4 layer Flexible PCB / FPC Assembly
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Conpany Profile
Product Details
Detailed Specification of Flexible PCB Manufacturing
Technical Specification | ||
Layers | 1~10 (flex Pcb) and 2~8 (rigid flex) | |
Min Panel Size | ||
Max Panel Size | ||
Min Finished board thickness | ||
Max Finished board thickness | ||
Finished board thickness tolerance | ||
Material | ||
Base copper thickness (RA or ED) | ||
Base PI thickness | ||
Stiffner: | ||
Min Finished hole diameter: | ||
Max Finished hole diameter: | ||
Finished hole diameter tolerance (PTH) | ||
Finished hole diameter tolerance (NPTH) | ||
Min width/spacing (1/3oz) | ||
Min width/spacing (1/2oz) | Single layer | |
Double layer | ||
Base Copper | ||
Size Tolerance | ||
Surface Treatment | ||
Dielectric Strength | ||
Solder Float | ||
Peeling Strength | ||
Flammability | 94V-0 | UL |
Flex PCB Fabrication with JIA-SPEED Electronics
Xi'an JIA-SPPEED, Electronic Technology Co., Ltd. has 16 years of PCB manufacturing, assembly experience, JIA-SPEED can provide our customers with flex printed circuit boards with a great variety of technologies, from simple single-sided flex boards to complex multilayer flex, from Commercial applications to high reliability military PCB. We can turn your flex PCBs as fast as in 7 days , depending on technologies. If you're looking for production quantities of flex or a flex pcb prototypeJIA-SPEED's experts are there to assist with every step Of the process at the best value.
Call us at +8613186089157 or get an instant PCB quote. Tell our experts what you need and we will provide you with the right PCB production and assembly solution. We are ready and eager to turn your concepts into reality.
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
Detailed Specification of Pcb Assembly
Type of Assembly | SMT and Thru-hole | |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free | |
Components | ||
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