99.95% Pure Tungsten Targets with W1 ASTM B760
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99.95% Pure Tungsten Targets With W1 ASTM B760
Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit.
Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.
Type | W(wt%) | Ti(wt%) | Si(wt%) | Purity(wt%) | Density(%) | Grain Size& (µm) | Dimension (max.mm) | Ra |
WTi10 | 90±0.5 | 10±0.5 | / | 99.9-99.999 | =99 | ?10 | ?400×40 | =1.6 |
WTi20 | 80±0.5 | 20±0.5 | / | 99.9-99.995 | =99 | ?10 | ?400×40 | =1.6 |
WSi10 | 90±0.5 | / | 10±0.5 | 99.9-99.999 | =99 | ?10 | ?400×40 | =1.6 |
WSi20 | 80±0.5 | / | 20±0.5 | 99.9-99.999 | =99 | ?10 | ?400×40 | =1.6 |
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