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Medical equip,
Thermal conductivity: 2W/M-K
(Hole Size) | (Drilling hole size) | 0.6-6.0 mm |
(FG hole size) | 0.6-6.0 mm | |
(Hole tolerance) | ±0.075 mm | |
(Tolerance of hole position) | ±0.1mm | |
(Aspect ratio) | 5:01 | |
(Solder) | (Min solder bridge) | 4 mil |
(Dimension) | (Tolerance of outline dimension) | (Length): 1200mm |
(Max board size) | (Width): 300mm | |
(Impedance) | (Impedance tolerance) | ±10% |
(Heat conductivity) | (Low heat conductivity) | 1.0-1.5W/m*k |
(Wid heat conductivity) | 1.5-1.8W/m*k | |
(High heat conductivity) | 2.0-3.0W/m*k | |
(Peel strength) | =1.8 N/mm | |
(Surface resistance) | =1*105m | |
(Volume resistrivity) | =1*106m | |
(Breakdown voltage) | =2KV/mm | |
(The solder resistance) | (260?,10min,no delamination no blister) | |
(Dielectric constant) | = 4.4 | |
(Dielectric power factor) | =0.03 |
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