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Introduction

I.M.T.’s HN-CU100 process for copper and copper alloy polishing provides good polishing effect and brightness to metal surface. It is easy to operate, low cost and with strong stability.

The polishing process removes a thin layer of material across the entire wetted surface of the part, thereby smoothing and polishing it in the microsphere. At the same time any particles, flakes, debris, contamination and structural damage contained in the surface layer is removed.

Item: HN-CU100

Advantages

1. With good polished effect and brightness;

2. Easy operation, low-cost, strong stability;

3. Suitable for copper and copper alloy polished.

Bath Composition and Working Conditions

Bath Composition and Process Conditions	Application Range	General dosage of making up
Sulfuric acid	330 ~ 370 mL/L	350 mL/L
HN-CU10 Polishing solution	330 ~ 370 mL/L	350 mL/L
Time	10 seconds-3minutes	30seconds
Temperature	Room temperature  ~ 35°C

Packing

A plating process includes at least one type of chemical additives.

Standard package is net 25kg/drum. Packed in plastic drum. 24 drums/pallet.

Some additives needs special package and will be specified in quotation sheet.