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1 before surface mount (SMT), IC (CSP, BGA, TQFP, TSOP) at room temperature and low humidity and wet preservation;

2. The printed circuit board and multilayer substrate before lamination (pressed substrate) desiccant custody and style film and prepreg humidity preservation;

. all kinds of electronic installation, semi finished products of low humidity preservation and installation process before the process and secondary process prevention of oxidation and low humidity storage;

4 electronic machine with a ceramic substrate or a ceramic condenser was saved;

5 crystal oscillator manufacturing engineering in crystal chips, electrode materials, adhesive of low humidity storage;

IC and LSI use 6 naked before installing COB (bare wafer) lead frame of low humidity storage;

The glass substrate 7 liquid crystal display (LCD) after cleaning drying at room temperature (keep uniform dehydration) was kept;

8 solid imaging element (CCD) at room temperature and low humidity drying preservation;

9 kinds of precision manufacturing materials, preservation of dehumidification and humidity of semi-finished products at room temperature;

10. The R & D / laboratory reagent (agent), standard, test piece, pure metal material, powder material (fine ceramics, epoxy resin matrix, drugs, then agent), filter paper, precision measuring dehumidification saved.