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1 before surface mount (SMT), IC (CSP, BGA, TQFP, TSOP) at room temperature and low humidity and wet preservation;
2. The printed circuit board and multilayer substrate before lamination (pressed substrate) desiccant custody and style film and prepreg humidity preservation;
. all kinds of electronic installation, semi finished products of low humidity preservation and installation process before the process and secondary process prevention of oxidation and low humidity storage;
4 electronic machine with a ceramic substrate or a ceramic condenser was saved;
5 crystal oscillator manufacturing engineering in crystal chips, electrode materials, adhesive of low humidity storage;
IC and LSI use 6 naked before installing COB (bare wafer) lead frame of low humidity storage;
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