HDI High Step PCB for Computer
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Product Details
Model NO.: HDI43
Dielectric: FR-4
Application: Computer
Mechanical Rigid: Rigid
Base Material: Copper
Layer: 4
Min Hole: 0.3mm
Type: Rigid Circuit Board
Material: Fiberglass Epoxy
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Insulation Materials: Epoxy Resin
Thickness: 2.0mm
Surface: Enig
HDI High Step PCB for Computer
HDI High Step PCB for Computer
Items | Speci. | Remark |
---|---|---|
Max panel size | 32" x 32"(800mm x 800mm) | |
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | |
Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width |
Min thickness(inner layer) | 4 mil(0.1mm) | without copper |
Inner copper thickness | 0.5~4 oz | |
Outer copper thickness | 0.5~6 oz | |
Finished board thickness | 0.4-3.2 mm | |
Board thickness tolerance control(±0.10 mm) | ±0.1 mm | 1~4 L |
Finished board thicknes(±10%) | ±10% | ≥6 L |
Inner layer treatment | Brown oxidation | |
Layer count Capability | 1-24 LAYER | |
Alignment between ML | ±2mil | |
Min drilling | 0.15 mm | |
Min finished hole | 0.1 mm | |
Hole precision | ±2 mil(±50 um) | |
Tolerance for Slot | ±3 mil(±75 um) | |
Tolerance for PTH | ±3 mil(±75um) | |
Tolerance for NPTH | ±2mil(±50um) | |
Max Aspect Ratio for PTH | 8:1 | |
Hole wall copper thickness | 15-50um | |
Alignment of outer layers | 4mil/4mil | |
Min trace width/space for outer layer | 4mil/4mil | |
Tolerance of Etching | +/-10% | |
Thickness of solder mask(on trace) | 0.4-1.2mil(10-30um) | |
Thickness of solder mask(at trace corner) | ≥0.2mil(5um) | |
Thickness of solder mask(on base material) | Finished thickness+1.2mil | |
Hardness of solder mask | 6H | |
Alignment of solder mask film | ±2mil(+/-50um) | |
Min width of solder mask bridge | 4mil(100um) | |
Max hole with solder plug | 0.5mm | |
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, | |
Max Nickel thickness for Gold finger | 280u"(7um) | |
Max gold thickness for Gold finger | 30u"(0.75um) | |
Nickel thickness in Immersion Gold | 120u---240u"(3um----6um) | |
Gold thickness in Immersion Gold | 1u"---5u"(0.025um----0.125um) | |
Impedance control and its tolerance | 50±10%, 75±10%,100±10% 120±10% | |
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | |
Bow and twist | 0.75% |
HDI High Step PCB for Computer
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tion within 4 hours after receiving quotation information, track and report the status of product
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