Find high quality high-frequency spindles for wafer dicing or silicon plate cutting with competitive price here. Please rest assured to buy high-frequency spindles for wafer dicing or silicon plate cutting with Luoyang Bearing Science and Technology Co.,Ltd

Providing with one of the famous high-frequency spindles for wafer dicing or silicon plate cutting brands free sample, Luoyang Bearing Science and Technology Co.,Ltd is one of the best high-frequency spindles for wafer dicing or silicon plate cutting manufacturers and suppliers in China. You can buy customized and low price bulk high-frequency spindles for wafer dicing or silicon plate cutting in stock and check its quotation with our factory.

High-frequency spindles for cutting performance

ZYS high-frequency spindles for wafer dicing use air static pressure bearings, and the wafer scriber spindles have high precision, low vibration, steady rotation and reliable performance.

Parameters

Type	Speed r/min	KW	Voltage V	Current A	Frequece Hz
92GD40Q	40000	0.75	220	2.6	666
80GD30Q	30000	0.5	165	2.5	500