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Microvia

Hemeixin is one of the first companies to provide volume HDI capability to our customers. Our continuous investment in developing world-class fine-line microvia technology has made us a leading microvia board manufacturer in China. Our deep experience and commitment to provide a complete solution for our customers helps to resolve early design issues, shorten lead time, and provide high quality cost effective product. 


• 20 sets UV/YAG and over 160 CO2
  laser heads
• ELIC (Every Layer Interconnection)

• Skipped, telescopic, stacked µvias

• 30 layers

• Min. microvia - 80µm

• Soldermask Registration: 25µm using
  direct imaging
• 50 um dielectric using 106 prepreg and
  40 um core handling available
• RoHS compliance
• Lead free & Halogen free                                                                                                                              

                                                                                                                                                                                                                                                                                                                                                           

   
 

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