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Sealed Carrier - Multilayer thin-wire substrate assembly is a component that uses high-density interconnect and assembly technology. The advantage of this kind of assembly is: Can use various substrates (such as ceramic substrate, glazed steel substrate, printed circuit board and phenolic board, etc.); Sensitive chip can be encapsulated in a sealed carrier, the package does not require large packages, the volume Weight is much smaller than the hybrid circuit; processability, debugability, maintainability is good; good heat dissipation; gas-phase remelting technology can be installed on both sides of the substrate carrier to improve the assembly density