SolverPI-Powder 1600

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Find high quality solverpi-powder 1600 with competitive price here. Please rest assured to buy solverpi-powder 1600 with SOLVER POLYIMIDE

Product Name: Thermoplastic Polyimide Moulding Powder

Item No.: SolverPI-Powder 1600

Mesh size: =200 Mesh

SPECIFICATIONS:

Properties		Testing Method	Unit	Value
Basic performance	Appearance	/	/	Light Yellow
	Linear expansion coefficient of (23-30?)	GB/T 1036-1989	1/?	3.68*10-5
	Density(25?)	/	g/cm³	1.38
	Intrinsic viscosity	Q/HSMT	dL/g	0.5-0.8
	Rockwell hardness (m)	GB/T 3398.2-2008	/	110
	Oxygen index	GB/T 2406.2-2009	%	46
	The vertical combustion	GB/T 2408-2008	level	V-0
Mechanical properties of	The tensile strength	GB/T 1040.2/1A-2006	MPa	108
	Elongation at break	GB/T 1040.2-2006	%	15
	The impact strength (no gap)	GB/ 1043.1/1eU-2008	KJ/m²	244
	The bending strength	GB/T 9341-2008	MPa	135
	The compression strength	GB/ T 1041-2008	MPa	136
	The coefficient of friction	GB/T 3960-1983(1989)	/	0.43
Thermal performance	The thermal deformation temperature(1.80MPa)	GB/T 1634.2-2004	?	250
Thermal performance	Glass transition temperature (nitrogen atmosphere)	GB/T 19466.2-2009	?	260
Electrical properties	Dielectric strength	GB/T 1408.1-2006	MV/m	16.3
Electrical properties	Volume resistivity	GB/T1410-2006	O·m	2.0*10¹⁴

Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent.

Main Characteristics:

l Creep resistance, radiation resistance, good wave penetrating ability;

l Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;

l Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

In a word, SOLVER Thermoplastic Polyimide Moulding Powder

(SolverPI-Powder 1600) can completely replace Mitsui AURUM.

Application:

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.

The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements.

Moulded Samples:

SolverPI-Powder 1600 (3).jpg