Tg170, Lead Free Telecom 4layer PCB
Min.Order : 1 Pieces Quick Quotation >
Conpany Profile
Product Details
Basic Info
Model NO.:XCE-D-2001
Dielectric: It170
Application: Communication
Processing Technology: Electrolytic Foil
Base Material: Copper
Brand: Xce
Trademark: XZG
Specification: ROHS
HS Code: 8534009000
Structure: Multilayer Rigid PCB
Material: Fr4
Flame Retardant Properties: HB
Production Process: Subtractive Process
Insulation Materials: Epoxy Resin
Size: 200mm*98mm
Transport Package: Vacuum Package
Origin: Guangdong, China
specification:
layer: 4
material: FR4 ITEQ
Tg value: tg170
board thickness:1.6mm
copper thickness:35um
minimum hole size:0.3mm
minimum line width and distance:5/5mil
surface treatment:Hasl lead free
Recommend Product