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LD8F10 Series

Features & Benefits:                                           

-High bond strength to surfaces 

-Excellent wet-out and high thermal performance 

Typical Application Includes:

-Where need mount heat sink onto BGA graphic/drive processor   

-LED Lighting

Configurations:

-Sheet form/roll form/die-cut parts

Available Thickness:

-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm

Typical properties of 8F10
Properties	8F10-T10		8F10-T15		8F10-T20		8F10-T25	8F10-T30
Reinforced Material	Fiberglass		Fiberglass		Fiberglass		Fiberglass	Fiberglass
Thickness	0.1mm		0.15mm		0.2mm		0.25mm	0.3mm
Peel Strength (PSTC-101)(N/25mm)	>13.72		>13.72		>13.72		>13.72	>13.72
Temp Resistance(S) °C (°F)	180(356)		180(356)		180(356)		180(356)	180(356)
Temp Resistance(L) °C (°F)	120(248)		120(248)		120(248)		120(248)	120(248)
Continues Use. Temp. (°C)	-20 to 120		-20 to 120		-20 to 120		-20 to 120	-20 to 120
Adhesion
Retention (1Kg/Inch/25°C)	>48	>48		>48		>48		>48
Adhesion(Kg/Inch)	1.1	1.4		1.4		1.4		1.4
Initial Bonding Strength(Kg/Inch)	0.6	1.3		1.3		1.3		1.3
Electrical
Breakdown Voltage	2	2.5		3.5		4		6
Thermal
Thermal conductivity (ASTM D5470)	1.0W/M.K	1.0W/M.K		1.0W/M.K		1.0W/M.K		1.0W/M.K

Remark:-Data for design engineer spec. reference only. Engineers are reminded to test the material in application.

-Shelf life: Leader recommend a 15-month shelf life at a maximum storage temperature range 23±5°C,relative humidity 60%±10% to keep its properties. 

Thermal Conductive Pads

LD8080,0.8w/m.k                           LD8100,1.0w/m.k

LD8100+F100,1.0w/m.k                 LD8120,1.2w/m.k

LD8150+F100,1.5w/m.k                 LD8150,1.5w/m.k

LD8200,2.0w/m.k                           LD8250,2.5w/m.k

LD8300,3.0w/m.k                           LD8400,4.0w/m.k

Custom-make thermal pads ,pls send inquiry to us.

Thermal tapes

LD8N12,1.2w/m.k           LD8F10,1.0w/m.k

Thermal Conductive Insulator

LD8K08,0.8w/m.k           LD8K10,1.0w/m.k