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1, YSP-DP75 semiconductor side pumped laser marking machine is specifically designed for the workpiece with depth requirements. Note: the surface of the workpiece or the circumference of a circle is added to a rotating marking system;

2, the use of a full modular design: each module has a corresponding independent operating space, the mutual connection is simple, direct, to minimize electromagnetic interference and thermal interference, to ensure the stability of the system for a long time;

3, super naked cavity design: professional laser resonant cavity design to ensure get maximum light efficiency and the best laser mode, and reduce the dependence on temperature.