Multi-wave Soldering System Multi-process
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Lead-free Selective Multi-Wave Soldering Machine
With the high precision and reliable making process, th soldering quality of the machine is beyond than the traditional wave soldering under some conditions.
Four Advantages
? Greatly improved the soldering quality and guaranty the consistency and reliable soldering quality to avoid the manual soldering defects.
? Fully solve the problem of the low efficiency of selective soldering improved the production growth more than ten times.
? Greatly save the number of soldering workers and improved the company production efficiency and benefits.
? Fully solve the soldering difficult that the traditional wave soldering can not solve.
Features
The spray system adopts X-Y platform +stepper motor drive, which can be selectively spraying and effectively save the flux. |  |
With the independent temperature control and using cesium heating lamp, the machine can significantly improve the thermal efficiency and temperature uniformity. |  |
The position of the PCB allows a high accuracy and reliability, which is controlled by the clamping device from the cylinder of X-Y-Z direction. |  |
The lifting of solder pot is adopted with the high precision ball screw rod and stepper motor control, which features the high position accuracy and quantifiable precise control. |  |
The soldering nozzle is adopted with the full Ti-alloy materal and high precision processing to ensure the stable performance. It totallymeets the soldering requirements from the PCB (bottom spaces max.50mm) and breaks throughout the process limits of traditional wave soldering and selective soldering. |  |
Specifications
Requirements and Specifications | ||
Items | Specification | Remark |
SGS-350 |
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Min.PCB size | 50(W)X120(L) mm | including the fixtures |
Max.PCB size | 450(W)X450(L)mm | including the fixtures |
PCB weight | Max. 8 KG | including the fixtures |
PCB upper space | 100mm |
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PCB lower Space | 50mm |
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PCB process edge | =4mm |
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Machine weight | =2000Kg |
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Body |
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Structure | three segment | available to splitting and combining |
Machine dimension | L5223×W1353×H1720 mm | |
Board Handling |
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PCB conveyor height | 750±50 mm |
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PCB conveyor speed | 0.5~10 m/min | Electronic-control |
PCB conveyor direction | L-R OR R-L |
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Conveyor stable | No jumping and shaking phenomenon |
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Conveyor resolution | 0.05mm/s | Encoder Frequency Max.1KHz |
Conveyor alarm | Real-time alarm card board, plate alarm |
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Width adjustments | Motorized |
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Fluxer Spray |
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Spraying height | 70~100 mm |
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Spraying travel | 450x450 mm |
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Spraying platform | XY table+stepper system | programmable |
Spraying nozzle movement speed | Max. 500mm/s | Stepper motor |
Re-position accuracy | ±0.25 mm |
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Spraying uniformity | ±3% or better |
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Spraying accuracy | ±1% or better |
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Nozzle self-cleaning | compression air cleaning |
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Exhaust | No flux on the surface | No flux for 8 hours working |
Maintenance range | > 1 week |
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Flux Flow | 10~200ml/min | flow meter control |
Flux buffer capacity | 2 L | available to have the external container |
Air pressure | 0.4 Mpa |
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Air consumption | 7m³/H |
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Flow accuracy | ±3ml | According to different kind of flux |
programming method | Teach programming | |
Preheater |
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Preheating | Max. 180? (PCB bottom surface) | |
Preheating | Max. 150? (PCB upper surface) | |
Temp. setting | Max. 300? |
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Temp. control | ±2? @3 sigma |
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PCB heating uniformity | 5? @3 sigma | Standard board |
Heating method | IR –heating | |
Heating power | 9*2KW |
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Heating | Hot air | Option :1.8m, 3 independent preheating zone |
Solder |
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Solder capacity | 200~400KG | |
Temp. Control | ±1? @ 3 sigma/Cpk=1.33 |
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Max.temperature | 300? (Highest 300?) | |
280?(highest used temperature 280?) |
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Heating power | 6*1.6KW |
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soldering wave heights | 0~4mm |
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Tin wave smoothness | ±0.1s @ 3 sigma |
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Solder pot in/out | Motorized | |
Solder up /down | stepper control system |
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Solder up/down travel | 50 mm |
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Solder wave driving | High precision motor | frequency converter control |
Solder melting time | <3 hr | |
Solder pot | Ti- alloy |
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Soldering nozzle | customized | |
PCB position | XYZ axis air cylinder clamping |
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Control System |
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Power supply | 3P5W 380V, 50/60Hz |
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Power | 35 KVA | Max.Power |
withstand voltage | 1500V 5S |
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Grounded resistance | <1 Ohm |
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Insulation resistance | > 25 Mohm |
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connector | Front and back power plug |
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Safety Compliance |
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components | CE |
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Electrical wire | CE/UL | Waterproof/fire/high temperature corrosion resistance |
Machine | CE (LVD/EMC/MD) |
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