Selective Wave Soldering Machine
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Product Details
Selective Soldering Machine
Features
? High accuracy
? Stable and reliable
? Production efficiency and maintenance easily
? Available offline programming
Used two zones hot air for the top preheating system.
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Adopted CCD camera to monitor solder processing,the soldering quality can be traced in whole processing. | Selective flux spraying can control the flux processing accurately as well as keeping the clear surface of PCB with extremely low flux consumption. | Transmission speed of wave nozzle is adjustable, In line wave height monitoring system and automatic calibration function. | The temperature controls for top and bottom preheating is independent, Cs lamp heating can improve heating efficiency ad temperature uniformiy. |
Specifications
Items | Description |
Model | NXP-450 |
Min.PCB size | L 120mm * W 60mm |
Max.PCB size | L 550mm * W 450mm |
PCB top side / bottom side clearance | Max.Upper 100mm/ bottom 50mm |
PCB process edge | 4mm |
Boards handling system | |
Conveyor system | 3 independent zone with independent control, chain and special turn plate |
Conveyor heights | 850+/-50mm |
Width adjustment | 60mm to 460mm |
Width adjustment accuracy | +/-0.2mm |
Conveyor direction | Left to right / right to left |
Preheating system – Bottom side | |
Preheating temperature/ Power | Max.160°C (PCB surface)/ Max.18KW |
Temperature control accuracy | +/-2°C@3 sigma/Cpk=1.33 |
Heater | Philips Cesium light, independent control |
Heating area | L 650MM * W 580MM |
Preheating system – Top side | |
Preheating temperature/ power | Max. 160°C (PCB surface)/ Max.8KW |
Temperature control accuracy | +/-2°C@3 sigma/Cpk=1.33 |
Heater | Hot air, independent control |
Fluxing system | |
Fluxer nozzle | micro drop jet fluxer |
Fluxing wet area | Ø2 mm to Ø5mm |
flux types | alcohol or water based |
Fluxing Controller | automatic level control with capacitive sensor |
Selective position method | X-Y Platform |
Position speed/ accuracy | Max.400mm/s , +/-0.25mm |
flux container | 3L pressure tank |
Soldering Unit for Soldering Processes | |
solder pot compatible for lead free soldering | Standard |
nitrogen operation | Standard |
automatic wave height and solder level control | Standard |
automatic wire solder feeder | Standard |
wettable and non-wettable quick change nozzles | Standard |
solder bath temperature | 300°C |
Temperature control accuracy | +/-2°C@3 sigma/Cpk=1.33 |
Solder pot capacity | 12kg lead free |
Wave heights | Max.5mm |
Solder pot moving speed | Max.400mm/s |
Soldering nozzle dimensions | Ø5 to Ø12mm (or customized) |
Control system |
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Power supply | 380VAC,3 P, 50/60Hz, 52A |
PCB data import | GERB file, Offline file import, Image program |
Programing interface | Windows interface |
Power | 35KW |
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