PCB for High Frequency Devices
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Product Details
Model NO.:XCE PCB
Dielectric:FR-4
Layer:1~20 Layers
Base Material:Fr1, Fr4, Cem-3, Aluminium, Ceramic
Copper Thickness:0.5~3.2mm
Surface Finishing:HASL,Lead Free HASL,OSP,Enig...
Board Thickness:0.5~3.2mm
Min. Line Spacing:0.08mm
Ring Annulus:Min 0.1mm
Layer to Layer Rrgistration:+/-0.003"
Hole Position Accuracy:+/-0.003"
Aspect Ratio:Min 1:8
Trademark:XCE
Specification:UL, SGS, RoHs, TS
Origin:Dalian, Liaoning
HS Code:8534009000
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
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